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经营范围
发明名称
CERAMIC PACKAGE MODULE
摘要
申请公布号
JPH03116947(A)
申请公布日期
1991.05.17
申请号
JP19890255885
申请日期
1989.09.29
申请人
TOSHIBA CORP
发明人
HATORI YASUO
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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