| 摘要 |
PURPOSE:To contrive the improvement of the reliability of a semiconductor package by a method wherein a metal frame mounted with an element or a resin film is pinched between a metal mold on one side and one sheet of a plate, a liquid epoxy cast resin composition is injected through a resin injection gate provided apart from this element under a reduced pressure or after the composition is injected, the composition is heated and hardened in a state that it is subjected to vacuum degassing. CONSTITUTION:A lead frame 3, on which a semiconductor pellet 1 is mounted and to which bonding wires 2 are connected, is placed between a metal mold 11 on one side and a plate 13 and a gate side metal mold 12 is pressed to the side of the plate 13. The metal mold 12 is provided with a resin injection gate 14 and a path 15 for reducing a pressure is formed at the position on the side opposite to the gate 14 between the metal mold 12 and the plate 13. In this state, a cast resin 7 passes through the gate 14, is injected in the interior between the metal molds, is filled in the peripheries of the pellet 1 and the like and is heated and set. Thereby, even if this package is thin, it is a voidless package and a highly reliable semiconductor package can be obtained. |
