摘要 |
A semiconductor device sealed with resin is disclosed. This semiconductor device comprises a semiconductor element, a lead, and a wire electrically connecting said semiconductor element and said lead. The semiconductor element, the wire, and a portion of the lead are sealed with sealing resin. Calcium hydroxide is added into the sealing resin to serve as a corrosion inhibitor. In the semiconductor device sealed with resin, corrosion of the copper wire can thus be suppressed in high temperature environments. |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
MATSUNAGA, YOSHIHIRO;NISHIMORI, TADAO;MATSUOKA, HIROMASA;SHIMAMOTO, KOZO, AMAGASAKI, HYOGO, JP;TSUMURA, KIYOAKI, ITAMI, HYOGO, JP |