| 发明名称 |
Improved apparatus for cooling electronics components. |
| 摘要 |
<p>A side-by-side double row of electronics packages (11) plug into a common backplane (30). Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.</p> |
| 申请公布号 |
EP0427656(A2) |
申请公布日期 |
1991.05.15 |
| 申请号 |
EP19900480152 |
申请日期 |
1990.10.09 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CORFITS, WILLIAM DALE;MOTSCHMAN, DAVID ROY;HOLAHAN, MAURICE FRANCIS;MARTINO, SUSAN JEAN;THORPE, JAMES ROBERT |
| 分类号 |
G06F1/20;H05K7/14;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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