发明名称 MANUFACTURE OF MULTILAYER CIRCUIT BOARD
摘要 PURPOSE:To satisfactorily connect one film base material to the land of other film base material by disposing a second intermediate film base material in which a hole of the size larger than that of a hole of an adjacent film base material between at least one film base material, a first intermediate film base material and the other film base material to be laminated, and hot pressing them. CONSTITUTION:Holes 191, 192 of size larger than that of the hole of a film base material adjacent to second intermediate film base materials 181, 182 are opened at the materials 181, 182. Then, other film base material 11b, the material 181, a first intermediate film base material 15, a second intermediate film base material 182 and one film base material 11a are sequentially laminated, and hot pressed. In this case, the materials 11a, 11b, 15, 181, 182 are plastically deformed, a land 14 deformed together with the material 11b at the lower side reaches a land 17 for connecting the material 15 through the hole 191 of the material 181 to be excellently connected. On the other hand, a land 13 deformed together with the material 11a at the upper side reaches a land for connecting the material 15 through the holes 192 of the material 182 to be excellently connected.
申请公布号 JPH03114293(A) 申请公布日期 1991.05.15
申请号 JP19890250440 申请日期 1989.09.28
申请人 TOSHIBA LIGHTING & TECHNOL CORP 发明人 SASAKI IKUE
分类号 H05K3/46 主分类号 H05K3/46
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