发明名称 BONDING METHOD
摘要 PURPOSE:To improve products yield by making a bonding tool ascend vertically up to a specified height, standing a part corresponding to the neck part of a loop straightly, moving the tool in the direction inverse to the direction forming the loop by a specified amount, and making the tool further ascend by a specified amount. CONSTITUTION:A bonding tool 14 is made to ascend vertically up to a point (a), and a part corresponding to the neck part N of a loop L is made to stand straightly. After the tool is made to further ascend up to a point (b), the tool is made to move as far as a point (c) in the direction inverse to the direction forming the loop L. After the tool is made to ascend from the point (c) up to a point (d), the tool is made to move in the direction forming the loop. Further the tool is made to descend; simultaneously or a little later, an upper clamp 9 is clamped for a short period, and back tension is applied to a wire 3; in this state, the wire 3 is bonded to a lead frame 19. By the effect of the back tension, an ideal loop shape wherein the loop L of the wire 3 is high and free from under-loop can be obtained.
申请公布号 JPH03114238(A) 申请公布日期 1991.05.15
申请号 JP19900242466 申请日期 1990.09.14
申请人 TOSHIBA CORP 发明人 YAMAGUCHI MASAYOSHI;TSURUTA TOSHIRO;SUZUKI NOBUSHI;NAGASHIMA SUMIO;CHIBA KOICHI;ATSUMI KOICHIRO;KASHIMA NORIYASU
分类号 H01L21/60 主分类号 H01L21/60
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