| 摘要 |
PURPOSE:To enable superior wire bonding when a lead part is warped upward or downward, by forming a recessed part on the guide surface part of a sample stand corresponding with the holding part of a holding board. CONSTITUTION:In a state where a holding board 4 ascends, a lead frame 10 is sent in a manner in which a first pellet part 15a is positioned at a bonding part. The holding board 24 descends, and a lead part 14 and an island frame part 13 are pressed against a guide surface 21a by a holding part 24a, thereby clamping the lead frame 10. In this state, a bonding head 25 operates, and a wire is bonded to a pellet 15 and the lead part 14 by a bonding tool 26. Since a recessed part 21c is formed on the guide surface 21a corresponding with the holding part 24a, when the lead part 14 is pressed by the holding part 24a, the lead part 14 is not only pressed against the guide surface 21a, but also deforms within the limitation of elasticity of the lead part 14 itself, and comes into closely contact with the guide surface 21a. |
