| 摘要 |
<p>PURPOSE:To control the thickness of a card to a small one, to contrive to reduce its cost and to obtain an IC card excellent in heat resistance by housing an IC module in a hole cut in a card backing and by sticking metal foil-base labels on the obverse and reverse sides of the card backing excepting an IC module part. CONSTITUTION:A hole 2 for housing an IC module is cut at the specified position of a card backing 1, an adhesive 5 is supplied to the inside of the hole 2 and the IC module 3 is inputted and bonded. Stainless foil-base labels 4 are stuck on the obverse and reverse sides of the card backing 1 excepting an IC module 3 part by hot gluing using a hot-melt active type adhesive. The card backing 1 and the thickness of the whole card are thinned when the position of height of a terminal surface is the same as that of a stainless foil-base label 4. As the card backing 1, a backing of single-layer constitution is used to enhance heat resistance and further as the label 4, stainless foil-base label is used so that a deformation is controlled to a smaller one by the rigidity of a stainless foil even if external stress is applied to the card backing 1.</p> |
