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发明名称
APPARATUS AND METHOD FOR SEALING OF SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH03112152(A)
申请公布日期
1991.05.13
申请号
JP19890251522
申请日期
1989.09.26
申请人
NEC CORP
发明人
HIRASAWA HIROKI
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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