发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To increase the adhering strength of the intermediate part of a wire material to a lead by forming a cutout at the wire insertion hole opening edge of a capillary, and so forming the ceiling surface of the cutout as to be parallel to the end face of the capillary. CONSTITUTION:A cutout 26e in which a ceiling surface 26f is parallel to a flat surface 26b is cut on an inner oblique surface 26c of the end of a capillary 26. Accordingly, the intermediate part of a wire material 36 is pressed with a suitable area under a proper pressure to the flat surface of an inner part 11a of the lead. That is, even if the intermediate part of the material 36 is pressed by a strong pressing force, a predetermined collapsed thickness can be maintained at the cutout 26e, and adhered to a lead in a state having a predetermined tensile strength at the flat surface 26b. As a result, a wire 13 is connected to the lead at a bonding part 13b with satisfactory bondability.
申请公布号 JPH03112140(A) 申请公布日期 1991.05.13
申请号 JP19890249124 申请日期 1989.09.27
申请人 HITACHI LTD 发明人 TAKEMURA MASATOSHI;ARAKI ISAO;HATORI KAZUO
分类号 H01L21/60 主分类号 H01L21/60
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