发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To realize a thin mounting without danger of wire disconnection by fusion-adhering a resin layer conducted by laser irradiation between the part of a circuit pattern and a connecting electrode, and electrically connecting both. CONSTITUTION:An electric component 13 having connecting electrodes 12 is provided on an alumina board 11, and a circuit pattern 14 is formed. The surface between the electrodes 12 and the pattern 14 is covered with a polybutadiene resin layer 15 mixed with TiO2 for preventing arrival of laser light to the board 11. Further, an acrylonitrile resin layer 15 containing metal particles is fusion-adhered to the whole surface. The layer 16 between the pattern 14 and the electrodes 12 is irradiated with a laser beam to be conducted and electrically connected.
申请公布号 JPH03112142(A) 申请公布日期 1991.05.13
申请号 JP19890251022 申请日期 1989.09.27
申请人 TOSHIBA LIGHTING & TECHNOL CORP 发明人 YOKOKOU YUUJI
分类号 H05K3/32;H01L21/60;H01L23/28;H01L25/00 主分类号 H05K3/32
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