| 摘要 |
<p>PURPOSE:To improve yield of a product by specifying the relationship among a rotation angle of a wafer which is generated when loading or unloading the wafer, a rotation angle of the wafer which is produced when treating the water, and the angle formed by the loading/unloading direction on the loading side wafer cassette and the loading/unloading direction of the wafer cassette on the unloading side. CONSTITUTION:When a rotation angle of a wafer 1 which is produced when loading or unloading the wafer 1 is set to theta1, a rotation angle of the wafer 1 which is produced when treating the wafer 1 is set to theta2, and an angle formed by the loading/unloading direction of a wafer cassette 20 on the loading side and that of a wafer cassette 21 on the unloading side is set to theta3, each theta1, theta2, and theta3 is set so that an expression theta1+theta2=360 deg.Xn+theta3 (n: integer) may be satisfied. Thus, the wafer 1 is stored in the wafer cassette 21 on the unloading side at the same position as in the wafer cassette 20 on the loading side after the treatment is completed, thus preventing the wafer 1 from hitting against the wall surface of the wafer cassette and a resist from being scattered. This will lead to an improved yield.</p> |
