| 摘要 |
PURPOSE:To obtain a dielectric resonator with superior Q characteristic by forming the film of copper with high purity, fine and superior adhesiveness, and with high physical property on the surface of a ferroelectric ceramic sintered body with an electroless copper plating method. CONSTITUTION:The ferroelectric ceramic sintered body 1 to which an activating treatment is applied is soaked in electroless copper plating solution, and metallic copper is deposited on the surface where a contact layer is exposed, and an electrode layer 3 with thickness of 5-10mu is formed. The following plating solution is used as the electroless copper plating solution, and plating is performed at 60-80 deg.C of bath temperature, Namely, the plating solution contains copper sulfate of 0.030-0.050M/L, EDTA of 0.035-0.100M/L, formalin of 5-10mg/L,2,2, bipyridyl of 10m/L, and PH of 12.0-13.0. Thereby, the Q characteristic of the dielectric resonator can be improved. |
