| 摘要 |
PURPOSE:To acquire a multilayer wiring board whose thickening efficiency of a wiring and pattern accuracy are improved by constituting a thin film layer by two layers of an lower layer of any metal belonging to 4A-group or 6A-group of the periodic table and an upper layer of Cu; and by two plating layers of a lower layer of Cu and an upper layer of Ni, Au, Pd or Cr. CONSTITUTION:A polyimide resin layer 2 is formed on a principal face of a ceramic board 1. A thin film 3 of Cr and a thin film 4 of Cu are formed successively by sputtering on a surface of the polyimide resin layer 2. Then, photoresist 5 is applied onto a thin film 4 of Cu. After pattern exposure is carried out through a photo mask 6, the photoresist 5 is removed from a wiring pattern part alone by development treatment. Cu plating 7 and Ni plating 8 are formed one by one by electrolytic plating. |
