发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 <p>PURPOSE:To prevent the generation of cracks to cause breakdown by constituting an electrostatic chuck of a metal ring shrink-fitted to the periphery of a base body, and screwing the chuck to a cooling means installed on a detachable fixing member so as to be free from water leak. CONSTITUTION:An electrostatic chuck is constituted by shrink-fitting a metal ring 5 to a ceramic base body 2 capable of sucking a silicon water 3. A fixing member 4 is equipped with a groove 8, and the chuck can be fixed on the member 4 with screws 7 outside the groove 8. A cooling means 6 capable of making cooling water flow in the groove 8 is constituted. When processing is performed by heating the chuck 1, that is, by heating the wafer 3, the means 6 is used in order to cool the ring 5 and prevent the decrease of compression stress applied to the base body 2.</p>
申请公布号 JPH03108354(A) 申请公布日期 1991.05.08
申请号 JP19890246032 申请日期 1989.09.21
申请人 FUJITSU LTD 发明人 ISHIMARU YASUSHI
分类号 H01L21/683;H01L21/68 主分类号 H01L21/683
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