发明名称 |
PROCESS OF MANUFACTURE OF SOLID ELECTROLYTIC CHIP CAPACITOR |
摘要 |
For mechanically stress-free assembly of a solid electrolyte capacitor, a system carrier whose cathode terminal and anode terminal are not parted before assembly is employed. The electrode terminals are parted from one another only after the welding of the anode wire to the anode terminal and soldering of the cathode contact to the cathode terminal, preferably being cut by a laser beam. |
申请公布号 |
EP0418560(A3) |
申请公布日期 |
1991.05.08 |
申请号 |
EP19900115787 |
申请日期 |
1990.08.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHNABEL, WERNER, DR.-ING., DIPL.-PHYS. |
分类号 |
H01G9/004;H01G9/00;H01G9/012;H01G13/00;(IPC1-7):H01G9/00 |
主分类号 |
H01G9/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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