| 摘要 |
PURPOSE:To obtain an apparatus wherein remaining stress is not deviated in a junction part and by which uniform eutectic reaction is obtained by providing specified positioning jig, heat block, rotation driving means and compressing mechanism, respectively. CONSTITUTION:The following parts are provided. A positioning jig 13 holds a semiconductor chip (silicon chip) 4 so that the chip can be compressed. A heat block 15 holds a material to be bonded (metal stage) 11 so as to face the semiconductor chip 4 which is held with the positioning jig 13 and heats the material to be bonded 11 to eutectic temperature. A means 21 rotates and drives the heat block 15. A compressing mechanism 25 compresses the semiconductor chip 4 which is held with the positioning jig 13 to the material to be bonded 11 which is held with the heat block 15 in a point contact state. A glass ball 26 is attached to the compressing surface of the mechanism 25. For example, the semiconductor chip 4 is overlapped on the bonding surface of the material to be bonded 11. Thereafter, the compressing mechanism 25 is compressed with an air cylinder 24, and the heat block 15 is rotated by using the handle 21. The bonding surfaces are made to fit, and uniform eutective reaction is generated. |
