摘要 |
A hologram delamination tool is described in which a frame has a cutting blade fastened to one side thereof such that the blade is tautly disposed across a channel formed in the frame. A pressure plate is slidably inserted into the channel to hold the blade flat such that when the cutting tool is used to delaminate a hologram from a substrate, the pressure plate keeps the thin blade from buckling and is retracted during the cutting by the force of the edge of the delaminating hologram to allow the hologram to rest on the top surface of the blade so that the hologram can be lifted away from the substrate upon completion of the delamination.
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