| 摘要 |
An adhesive (14) is disclosed which is useful in bonding dissimilar adherends, such as silicon and plastic or stainless steel. The adhesive is particularly useful in bonding a printhead (12) and a pen body (10) for use in a thermal ink-jet printer, since it allows positioning of the printhead relative to the pen body prior to curing and, once cured, it seals against the aqueous-based ink contained within the pen body and provides structural integrity over the lifetime of the pen. The adhesive comprises a resin/hardener consisting essentially of a solid polyamide dispersed in an unmodified diglycidyl ether of bis-phenol A, an aliphatic epoxy silane coupling agent, and, optionally, a reactive diluent and/or fumed silica, and is given by the formulation resin/hardener: 70 to 99 (% wt/wt) silane coupling: 0.5 to 3.5 reactive diluent: 0 to 20 fumed silica: 0 to 5.
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