发明名称 Method and device for the uniformly even application of a resin coating on a substrate
摘要 Method and device for the uniformly even application of a resin coating on a substrate, wherein it comprises a rotary plate (1) receiving the substrate (3) and provided with means for rendering the substrate stationary on the plate so that rotation of the plate (1) provokes the spreading of a thin coating of the resin over the surface of the substrate. A concentric cover (3) is superimposed on the circular plate (1) and provokes the rotation of this cover along with the plate by confining the gaseous volume constituted by a suspended solvent preserving the properties of the dissolved resin during the spreading cycle constituting the internal atmosphere in which the substrate is placed, this volume being driven in rotation approximately synchronous with the plate and the cover.
申请公布号 US5013586(A) 申请公布日期 1991.05.07
申请号 US19890407362 申请日期 1989.09.14
申请人 SOCIETE ANONYME DITE: SULZER ELECTRO-TECHNIQUE "S.E.T." 发明人 CAVAZZA, GILBERT
分类号 B05C11/08;B05D1/40;G03F7/16;H01L21/027;H01L21/30 主分类号 B05C11/08
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