发明名称 MOUNTING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To simplify the removal of welding pressure as well as to reduce the time required for replacement of an element by a method wherein a pressure-adjusting bolt, having a device with which the bolt can be moved in the axial direction without making a pivotal movement, is screwed in the controlling plate which was arranged facing the side plates through the intermediary of a spring, an element is held by pressing in between the side plates. CONSTITUTION:A guide plate 16 is fixed on one of the side plates 8 using a screw, a control plate 15 is arranged between the section below the neck of the pressure-adjusting bolt 11, to be penetratingly inserted, and a guide plate 16 through the intermediary of a bearing 14 and a ball 17. On the surface facing the guide plate 16 of the control plate 15, a ring-shaped groove having the same center shaft as the bolt 11 is provided, three grooves, for example, which are inclined in the same direction are provided on the other guide plate 16a in such a manner that it is overlapping the ring-shaped groove, and the ball 17 is held between each groove. When the element is retained, the ball 17 is located at the deepest position in the groove 16a, and the ball is pressed by the force of a spring 12, located between the control plate 10 and the side plate 8, and the screw-in position of the bolt 4. When the ball is removed, a handle 20 is inserted in the control plate 15, the control plate is rotated, the ball 17 is shifted to the shallow position of the groove 16a, and the pressing force can be removed easily by pressing the spring 12.</p>
申请公布号 JPS57141943(A) 申请公布日期 1982.09.02
申请号 JP19810028136 申请日期 1981.02.26
申请人 MITSUBISHI DENKI KK 发明人 MIKANE TOSHIO
分类号 H01L21/52;H01L25/11 主分类号 H01L21/52
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