发明名称 |
ELECTRONIC CHIP CONNECTION ASSEMBLY AND METHOD |
摘要 |
AN ELECTRONIC CHIP CONNECTION ASSEMBLY AND METHOD This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.
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申请公布号 |
CA2002315(A1) |
申请公布日期 |
1991.05.06 |
申请号 |
CA19892002315 |
申请日期 |
1989.11.06 |
申请人 |
AMHET MANUFACTURING COMPANY, INC. |
发明人 |
SCHROEDER, JON M. |
分类号 |
H05K1/02;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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