| 摘要 |
<p>PURPOSE:To enable heat released from an integrated circuit to be effectively dissipated without making the mounting method of the integrated circuit complicated by a method wherein the integrated circuit is mounted on the surface of a multilayer wiring board, and heat released from the integrated circuit is dissipated from the wiring board through heat dissipating vias. CONSTITUTION:A large number of wiring layers 11 composed of insulating films 8 of low dielectric constant and conductor films 10 are laminated to form a multilayer wiring board 3. Two or more heat dissipating vias 12 are provided to the multilayer wiring board 3 extending from the surface of a board 2 to mounted integrated circuits 4. That is, the heat dissipating vias are shaped nearly into rods excellent in thermal conductivity and serve as a means which thermally connects the mounted integrated circuits 4 with the board 2. Therefore, when the integrated circuits 4 mounted on the surface of the multilayer wiring board 3 release heat, the heat released from the integrated circuits 4 is conducted to the board 2 through the heat dissipating vias 12. By this setup, heat conducted through heat dissipating vias can be efficiently dissipated.</p> |
