| 摘要 |
PURPOSE:To make a semiconductor element small-sized, to realize a small-sized and multipin package by a method wherein a resinsealed part is formed only on the surface of a film-like substrate and outer leads whose surface has been fixed and bonded by an insulating layer are attached to the circumference of the resinsealed part. CONSTITUTION:A film-like substrate 9 is constituted of an interconnection pattern including inner leads 8, outer leads 5 and a die pad 7, of an insulating layer a 4 and of an insulating layer b 6. The inner leads 8 arranged around the die pad 7 are extended to the outer leads 5; the outer leads 5 are extracted at the same pitch in such a way that they are perpendicular to individual sides of a resin-sealed part 3. The insulating layer a 4 is fixed and bonded to the surface excluding tip parts of the inner leads 8 and to the whole surface of the outer leads; the insulating layer b 6 whose shape is nearly the same as that of the resinsealed part 3 is fixed and bonded to the side and the rear surface of the inner leads 8. Since a thin copper foil of about 35mum is used for the interconnection pattern of the inner leads 8 and the outer leads 5, each tip pitch of the inner leads 8 can be etched fine at 0.16 to 0.18mm. |
