| 摘要 |
<p>A curable epoxy resin composition comprising an epoxy resin and a curing agent exhibit extended pot life, and lower reactivity at ambient temperatures when the curing agent comprises 2 to 10 parts by weight per 100 parts by weight of epoxy resin, of the salicylate salt of 1-isopropyl-2-methyl imidazole. They can readily be cured at 50 to 200<o>C.</p> |
