| 摘要 |
<p>An automated method for continuously patterning a tape with a plurality of different interconnection patterns, to which an integrated circuit may be bonded using tape automated bonding, including selectively exposing a portion of a photographic film layer (48) of the tape to computer-directed energy forming an integrated circuit interconnection pattern, and an identifying pattern, and developing the film (48) to provide an image of the interconnection pattern. A photoprocessable layer of the tape is then exposed through the film layer (48) to directed energy and processed in conjunction with a conductive layer (44) in order to provide conductors which correspond to the interconnection pattern being fabricated. Also disclosed is a method of high speed patterning of a tape. Further disclosed is a novel material and apparatus for generating TAB tape.</p> |
