发明名称 Modular housing assembly for two imcompatible circuits.
摘要 <p>A modular housing assembly is provided for two incompatible circuits, for example an RF circuit and a digital circuit, mounted on the same printed circuit board. The housing assembly has a base member and a cover member which are meshed to form two double walled compartments separated by a double conducting wall. The circuit board has at least one bridge physically and electrically connecting the two circuits on the board which bridges pass through corresponding channels in the separating wall and each contain a matrix of plated through holes which operate to extend the wall through the bridge. Interconnecting wiring is woven through the holes to pass desired signals. Filters are provided between the interconnecting wiring and each circuit to eliminate conductive interference. Conductive gaskets are provided at all junctions of the separating wall with a housing member or with a circuit board to further reduce radiation leakage between the circuits.</p>
申请公布号 EP0424606(A1) 申请公布日期 1991.05.02
申请号 EP19900110298 申请日期 1990.05.30
申请人 HEWLETT-PACKARD COMPANY 发明人 COOK, GORDON V.;RISLEY, CURTIS A.;TELFORD, LARRY E.;KOTFILA, MARK;STANLEY, DICK
分类号 H05K5/00;H05K7/14;H05K9/00 主分类号 H05K5/00
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