MULTI-LAYER LEAD FRAMES FOR INTEGRATED CIRCUIT PACKAGES

摘要

2065295 9106978 PCTABS00005 A composite lead frame (70) is provided. The lead frame (70) comprises a rigid metal portion (30) electrically interconnected (72) to a flexible multi-layer portion (40). The composite lead frame (70) provides for higher lead densities with better electrical and mechanical properties than achieved with either rigid metal lead frames or flexible leads.