发明名称 METHOD OF INTRODUCING AN INTEGRAL THERMO-BONDED LAYER INTO THE SURFACE OF A THERMOFORMED SUBSTRATE
摘要 The invention relates to a process of thermoforming thermoplastic substrates. More particularly the method of the invention relates to a method of thermoforming thermoplastic substrates wherein an integral coating is formed on the thermoplastic substrate that is resistant to removal of the coating. The novel coating method of the invention produces coated thermoplastic substrates wherein the coating is intimately bonded to the substrate. The coated substrates are hard, abrasion resistant, mold resistant, chemically resistant, and solvent resistant. The coating composition employs in a solvent base a pigment and a thermoplastic material compatible with the to be coated thermoplastic substrate. The thermoplastic material in cooperation with the pigment, solvent and other components of the coating composition after coating on the thermoplastic substrate, are heated to a thermoforming temperature and the thermoplastic material is intimately fused to the thermoplastic substrate surface.
申请公布号 CA2025652(A1) 申请公布日期 1991.05.01
申请号 CA19902025652 申请日期 1990.09.18
申请人 FULLER (H. B.) COMPANY 发明人 BATDORF, VERNON H.
分类号 B05D3/02;B05D7/04;C08J7/04;(IPC1-7):B05D3/02 主分类号 B05D3/02
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