| 摘要 |
PURPOSE:To obtain a wiring board insulating a plated through-hole having high resistance to thermal stress y sandwiching three layer or more of two or more kinds of board materials, and employing a low linear expansion coefficient for an internal layer board. CONSTITUTION:A sandwiched multi-layer printed wiring board 1 is formed by laminating two sets of glass polyimide laminate plates 13 and a glass epoxy laminate layer 14 having a lower linear expansion coefficient than the laminate plate 13. Hereby, the wiring board 1 is more resistant to heat stress, and hence a multi-layer printed wiring board having a plated through-hole 4 improved in resistance to thermal stress is yielded. |
