| 摘要 |
PURPOSE:To prevent the generation of cracks by enabling the flattening of the surface by a method wherein an inorganic insulation film and an organic resin film with a smaller coefficient of thermal expansion than that of the (n+1)-th conductor layer are successively laminated on the n-th conductor layer. CONSTITUTION:The multilayer interconnection structure consists of the n-th conductor layer 3, an insulation layer laminated on the n-th conductor layer 3, and the (n+1)-th conductor layer 6 laminated on the insulation layer. At that time, the insulation layer is made of the inorganic insulation film 4 laminated on the n-th conductor layer 3 and organic resin film 5 with a smaller coefficient of thermal expansion than that of the (n+1)-th conductor layer 6. This construction enables the flattening of the surface and eliminates the generation of cracks. |
