| 摘要 |
PURPOSE:To prevent deformation of the tip of an inner lead by sealing resin while the area between adjacent inner leads is fixed by an interlocking piece. CONSTITUTION:A band-shaped material is machined by the stamping method and an inner lead 4 is formed at a position closer to a tie bar 7 than a bonding area so that it is connected slightly by the adjacent inner lead and an interlocking piece 11. Then, coining treatment is performed, a semiconductor chip 3 is placed on a die pad 2 through the plating process for performing plating at the tip part after securing a flat width at the tip part of the inner lead and then wire bonding is performed. Then, resin sealing is performed leaving an opening so that the interlocking piece 11 may be exposed from an opening W of a package 6 and the interlocking piece 11 is cut off by laser treatment from the opening W of the package 6. Finally, a resin M is filled into the opening W of this package. Then, a frame body 10 and the tie bar 7 are cut off and the outer lead is machined to a desired shape, thus completing a semiconductor device. |
