| 摘要 |
A material removing tool wherein a wheel-shaped, rod-like, tubular or otherwise configurated carrier supports pulverulent and/or granular particles of abrasive material which are joined to each other and/or to the carrier by active solder, such as an alloy or an eutectic of copper, silver, titanium and/or zirconium. The particles can be individually joined to the carrier or they can form a compact wherein the particles are held together by active solder. The compact can be joined to the carrier by active solder or by a standard solder, such as common solder or eutectic solder. That surface of the carrier which is joined with particles of abrasive material can be provided with recesses for portions of abrasive particles which are joined to the carrier by active solder.
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