发明名称 MULLITE MULTILAYER WIRING BOARD
摘要 PURPOSE:To prevent the chipping of a printed pattern by the adhesion to a spacer, and the swelling inside a board so as to improve the yield rate in manufacturing by using a vehicle, consisting of specified viscosity of ethyl cellulose, specified polymerization degree of polyvinylbutyral, and solvent at a specified mixing rate, for printing paste. CONSTITUTION:For a multilayer wiring ceramic board, through holes reformed in green sheets 1 and 1', and conductor paste is filled therein by a screen printing method, and a pattern 5 for reinforcement for improving the strengths of a wiring pattern 4 and a pin is formed by a screen printing method. These sheets are aligned in a required number of layers, and are laminated after inserting spacers 2 and 2' between heat plates 3 and 3'. For this printing paste, a vehicle is used, which consists of 5-10 parts of weight of 10-80wt.% polyvinylbutyral (polymerization degree 600-1000) and 20-90wt.% ethyl cellulose (viscosity 10-45CP) and 90-95 parts of weight of solvent.
申请公布号 JPH03102895(A) 申请公布日期 1991.04.30
申请号 JP19890239922 申请日期 1989.09.18
申请人 HITACHI LTD 发明人 KUROKI TAKASHI;TSUCHIDA SEIICHI;ISHIHARA SHOSAKU;FUJITA TAKESHI
分类号 H05K3/46 主分类号 H05K3/46
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