| 摘要 |
A process for producing a rod-form silica from a silicic acid ester according to a sol-gel process, which silica has a rod-form having a high aspect ratio and is advantageously used as a filler for resin sealants for semiconductors, is provided, which process comprises adding 35 to 150 parts by weight of a sol of a silicic acid ester to 100 parts by weight of a hydrophobic medium to form an emulsion, subjecting the emulsion to a temperature rise at two stages, the first temperature rise being by 5 DEG to 30 DEG C. at a rate of 10 DEG to 200 DEG C./min. or less and the second temperature rise being by 3 DEG to 20 DEG C. at a rate of 0.5 DEG to 10 DEG C./min., to form a rod-form silica.
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