| 摘要 |
<p>PURPOSE:To provide a high breakdown strength, even under such condition as room temperature or low temperature where a large thermal stress is induced, by performing secondary setting in the vicinity of a conductor, the temperature of which rises when the conductor is actually used, at a higher temperature as compared with other sections. CONSTITUTION:Base epoxy resin filled with inorganic particles is molded and subjected to primary setting and the vicinity of a conductor, which is brought into high temperature when it is actually used, is then subjected to secondary setting at a higher temperature as compared with other sections. In other words, an insulating spacer 30 is placed in a secondary curing oven 20 upon finish of primary setting process and unmolding, where the secondary curing oven 20 is heated by means of a heater 21, and a thermal insulating mold 11 composed of material having high heat resistance is arranged such that it covers only the section requiring heat resistance. When secondary setting is carried out under high temperature, high heat resistance can be achieved.</p> |
