| 摘要 |
PURPOSE:To reduce the temperature change of a wafer during conveyance by constituting a conveyance mechanism, which conveys a substrate to be processed, such that the margin of the substrate to be processed is held at plural points by plural claws for holding the substrate. CONSTITUTION:A ring-shaped supporting frame 52 is provided at the end of the arm 51 of a wafer holding part 50. And three pieces of claw-shaped supporting members 60 are attached approximately at equal intervals so that the supporting parts 62 at the ends may be projected toward the inside of the supporting frame 52. Taper edges 64 are formed on the tops of these supporting parts. These taper edges 64 are sloped downward as they go to the tops. And a wafer W is supported at three points by the taper edges of the supporting parts 62, so the area of the contact part between the wafer W and the supporting member 60 becomes extremely small. For this reason, even in the case where the temperature difference between the wafer W and the supporting member 5 is as high as 70-80 deg.C such as after baking treatment, the temperature change of the wafer W before and after the holding can be suppressed to the range of + or -0.3 deg.C. |
