THICK FILM/THIN FILM HYBRID MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To obtain a high density and high reliability thick film/thin film hybrid-type multilayer interconnection board by a method wherein a matching layer with which the circuit terminals of a thick film interconnection board are electrically connected to the circuit terminals of a thin film interconnection board is provided. CONSTITUTION:A ceramic interconnection board 10 is composed of alumina boards 11 on which W-conductors 12 and register marks 15 are printed and which are connected to each other with through-holes 13 filled with W and has lands 14. A thin film circuit part 20 is formed on the board 10 with a matching layer 30 composed of the exposed through-holes 13 and pads 31 attached to them between and an LSI 40 is mounted. In order to form the pad 31, the position of the hole 13 on the board surface is estimated by a computer from the register marks 15 on the board 10. The relations between the estimated position and the position of the through-hole of the thin film circuit 20 which is to be connected to the through-hole 13 are calculated to obtain an imaginary curve. The conductor pad 31 having the imaginary curve as its outline is selectively formed. The thin film circuit 20 is composed of polyimide resin films 21 and copper thin films 22. With this constitution, a thick film/thin film hybrid-type multilayer interconnection board can be obtained.