发明名称 MANUFACTURE OF OPTICAL SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To reduce water entering area by supporting a piece with an outer lead terminal and a cut lead terminal and cutting the lead terminal for cutting after primary molding. CONSTITUTION:A light emitting element 30 and a photodetector 31 facing each other are mounted on a light emitting side and a light receiving side lead frames 32, 33 respectively. The elements 30, 31 are subjected to primary molding with a transparent resin 34 and then secondary molding with a light shielding resin 35. Mounting pieces 37, 38 are supported by outer lead terminals 41, 42 and cut lead terminal 43, 44. Herein, narrowly formed frame 32, 33 are utilized so that the lead width of each lead terminal 41-44 reduces the water entering area, and the elements 30, 31 are mounted on the mounting pieces 37, 38. Then the primary molding is carried out and subsequently after the cutting of the lead terminals 43, 44, the secondary molding is carried out. In the primary molding, strength capable of resisting a stress can be obtained and water entering the package in cleaning process can be reduced so that moisture resisting reliability can be improved.</p>
申请公布号 JPH03101174(A) 申请公布日期 1991.04.25
申请号 JP19890238451 申请日期 1989.09.13
申请人 SHARP CORP 发明人 MATSUO YOSHIHIKO
分类号 H01L23/48;H01L31/12 主分类号 H01L23/48
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