| 摘要 |
The invention relates to an electrical contact element as through-plating of a printed-circuit board for the production of double-sided population of a printed-circuit board with electrical components to form an electronic assembly based on surface-mounting technology (SMT), the contact element passing through a hole in the printed-circuit board and being soldered, such that it makes electrical contact, by means of dip-soldering or wave-soldering on one side of the printed-circuit board to a contact part of the printed-circuit board, said element consisting of a stamped sheet-metal part and having a soldering leg which passes through the hole in the printed-circuit board, to which leg there is linked a contact piece, on the region opposite the dip-soldering or wave-soldering point, which contact piece is connected via a solidified soldering paste layer to a printed-circuit board contact point, on said printed-circuit board. <IMAGE> |
