Forming long arrays from short components.

摘要

Process and apparatus for fabricating an extended scanning or printing array in which several smaller scanning or printing chips (5) are bonded end-to-end onto the surface of a glass substrate (10) having an opaque thermally and/or electrically conductive coating (19) thereon, with the coating removed at discrete sites (24) to allow a photocurable adhesive (30) placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip-bonding adhesive (38) deposited on the conductive coating where the chips are located is cured to provide a permanent structure.