| 摘要 |
PURPOSE:To enable the formation of a module product provided with a hybrid electronic circuit with two or more semiconductor elements and resistors by a method wherein suspension pins which hold a lead frame and a sealed semiconductor element as they are connected together are formed at the ends of the lead frame. CONSTITUTION:Leads 20... extending toward the center from a peripheral frame are formed out of a copper frame or the like by a press. The leading ends of the leads are made free, and the most large metal bed 21 is formed nearly at the center of the frame and supported by wide belt-like support 22. Other metal beds 23... are formed at the intermediate points of some of the leads 20. Furthermore, suspension pins 24 are formed near corners of the lead frame along directions in which the leads 20... extends. Semiconductor pellets 25... are mounted on the metal beds 21 and 23..., metal fine wires 26... are ball- bonded between the pellets 25 and the leads to constituted an electronic circuit. The suspension pins 24 are removed by cutting at the formation of the outer leads 20 and the support 22 after a semiconductor device is sealed with resin. |
