| 摘要 |
<p>A wafer processing method comprising the steps of:- attaching a glue-carrying flexible protection film over a surface of said wafer, by the glue, to protect the surface of the wafer; baking said protection film attached to the wafer, to provide for easy peel-off of said protection film with the glue from the wafer; and mechanically peeling off said glue-carrying protection film from said wafer.</p> |
