| 摘要 |
<p>PURPOSE:To prevent imperfect insulation and permeation of water caused by discharge from a suspension pin, by a method wherein the frame side root of the suspension pin for fixing a frame mounting a semiconductor element chip to a tie bar is thinned, the suspension pin is pulled out after the frame is coated with resin, and the pulled-out part is coated with resin. CONSTITUTION:A semiconductor chip 3 is mounted on a frame 2, which is fixed to a tie bar 7 by suspension pins 1 and leads 4. The frame 2 side root of the suspension pin 1 is thinned. The frame 2 is sealed with resin; the suspension pins 1 are pulled out, and cut at the frame 2 side thinned roots; the leads 4 are cut out from the tie bar 7. Then the cut part of the frame 2 is coated with resin 6. Thereby imperfect insulation caused by the discharge of the suspension pins 1 can be prevented, and permeation of water from the suspension pins 1 can be prevented.</p> |
