| 摘要 |
<p>PURPOSE:To obtain a device wherein the total thickness of a sealing resin is made to be as thin as 1.0mm or less without the new problems of the deformation of leads, deterioration in wafer handling and the like by sticking a thin film between the lower surfaces of the inner end parts of branched supporting leads facing to each other, and mounting a semiconductor chip on said film. CONSTITUTION:A semiconductor chip 2 is wire-bonded to the inner part of each lead 3 which is arranged at the peripheral part of the chip 2. The semiconductor chip 2 and the inner end parts of the leads 3 are sealed with a sealing resin 5 in this resin sealed type semiconductor device. An inner end part 6a is branched on both sides. The inner end parts 6a are located at the lower parts of the leads 3. At least a pair of supporting leads 6 are so arranged as to face each other. A thin film 7 is provided between the lower surfaces of the inner end parts 6a of the supporting leads 6. The thin film 7 is thinner than the lead 3. The semiconductor chip 2 is mounted on the thin film 7. For example, as the thin film 7, a thin film wherein a bonding agent having the thickness of 0.01mm is laminated on a polyimide-based resin film having the thickness of 0.02mm beforehand is used. The thin film is bonded to the lower surface of the branched inner end parts 6a of the supporting leads 6 by thermal contact bonding.</p> |
