发明名称 MANUFACTURE OF BOARD FOR MOUNTING ELECTRONIC PARTS
摘要 PURPOSE:To ease soldering between a conductor pin and a through-hole by using the conductor pin with a head part which is of the same length as the depth of the through-hole, inserting it into the through-hole, dipping the rear surface of the printed- circuit board which is opposite to the side where the conductor pin is inserted into a fused solder bath, and then filling solder between the head part and the through-hole. CONSTITUTION:A conductor pin 1 has a head part 11, a collar 12, and a leg part 13. The leg part 12 is gold-plated 10. Also, the length of the head part 11 is the same as the depth of a through-hole 91. The conductor pin 1 is inserted into the through-hole 91 of a printed-circuit board 90 from the direction of an electronic parts mounting part 95. Then, with the printed-circuit board 90 where the conductor pin 1 is inserted into the through-hole, the rear surface of the printed-circuit board which is at the opposite side of the insertion side of the conductor pin is allowed to contact the upper surface of a fluxing solder bath 80. Thus, the fused solder 80 intrudes into the gap between the head part 11 and the through-hole 91 according to capillarity. In a printed- circuit board for mounting electronic parts 3, a solder 8 is filled in the area between the through-hole 91 and the head part 11 and between a land 94 and a collar 12. Then, no blow holes are generated within the solder 8.
申请公布号 JPH0395962(A) 申请公布日期 1991.04.22
申请号 JP19890232392 申请日期 1989.09.07
申请人 IBIDEN CO LTD 发明人 ISHIDA NAOTO
分类号 H01R43/00;H01L23/50;H05K3/30;H05K3/34 主分类号 H01R43/00
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