| 摘要 |
PURPOSE:To secure a specified lead width and enable wire bonding to be made highly densely by enabling an inner lead of a lower layer of a laminated FPC to protrude toward a semiconductor chip side from the inner lead of an upper layer and by shifting the plant layout of a bonding part of the inner lead and outer lead of the FPC between the upper and lower layers. CONSTITUTION:A lower-layer FPC 16 and an upper-layer FPC 18 are placed by shifting the position of bonding part forward and backward so that each bonding parts 28, 29, 30, and 31 may not cross one another. An inner lead 24a of the lower-layer FPC 16 is formed at a specified gap with a lead width needed for bonding and an inner lead 25a of the upper FPC 18 is also formed with a lead width needed for bonding, where the upper-layer inner lead 25a and the lower-layer inner lead 24a are placed by shifting the plane layout and an outer lead 24b of the lower-layer FPC 16 and an outer lead 25b of the upper- layer FPC 18 are placed by shifting the plane layout in the similar manner. Also, pads 26 and 27 which are placed in columns on a semiconductor chip 14 are placed by shifting the plane position. |
