| 摘要 |
PURPOSE:To adjust the dislocation of the electrode of a semiconductor element and the electrode pattern of a submount by forming a dam, where a part of a patterned electrode is exposed, out of macromolecular material, and arranging a globular or angular solder bump inside the dam. CONSTITUTION:An electrode to form a solder bump 15, and a dam 16 such as that Ni is exposed to the pad 17 for wire bonding, are provided, and solder is formed on an electrode pattern 14 exposed inside the dam 16. Next, the resist of the pad 17 is fused together by applying flux on a solder bump part and heating it, and the bump shape is made angular. Flux is applied on the solder bump 15 of a submount, and a LED array 12 is put, in line with each electrode 13, on the solder bump 15. It is heated and fused, thus the fusion between the solder bump 15 and the electrode 13 of the LED array 12 is done. At this time, the fusion between the solder bump 15 and the electrode 13 of the LED array 12 is done. Also by self alignment effect by the surface tension of the solder bump, alignment accuracy of 10mum or less is achieved. |
