METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR,申请号JP19890231879-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR
摘要
申请公布号	JPH0395944(A)	申请公布日期	1991.04.22
申请号	JP19890231879	申请日期	1989.09.07
申请人	SHARP CORP	发明人	SHIMANO KIYOJI;IWASAKI NORIKI;FUJITA KAZUYA;UCHIDA HIROFUMI
分类号	H01L21/56;B29C45/02	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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