发明名称 BONDING METHOD
摘要 PURPOSE:To accurately grasp the etching state of a dielectric passivation film, to establish a bonding method which is not affected by the influence of corrosion and to obtain an electric element having high reliability by forming in advance an anticorrosion layer made of metal, and allowing a region not formed with the anticorrosion layer to remain on the pad, etc. CONSTITUTION:An anticorrosion layer 8a made of metal having anticorrosion properties is previously formed on a bonding pad 3a in the case of etching a passivation film 4. In this case, a region not formed with the layer 8a is allowed to remain on the pad 3a. When a bonding window hole 6a is opened at the film 4, the layer 8a is selectively etched to the pad 3b of the region not formed with the layer 8a, and when corrosion 9 is present on the pad 3b of the region not formed with the layer 8a, it is judged that the etching of the hole 6a is completed to finish etching. Thereafter, a bonding wire 7 is bonded to the layer 8a in the hole 6a.
申请公布号 JPH0396244(A) 申请公布日期 1991.04.22
申请号 JP19890233982 申请日期 1989.09.08
申请人 FUJITSU LTD 发明人 SATO KIYOSHI;FUJIWARA YOSHIAKI;HASHIMOTO KAZUYUKI
分类号 H01L21/60 主分类号 H01L21/60
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